Power chips are attached to exterior circuits through product packaging, and their efficiency relies on the assistance of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip affiliation describes the electric connection on the upper surface area of the chip, which is normally aluminum bonding cord in conventional modules. ^
Traditional power module package cross-section
Presently, industrial silicon carbide power components still primarily utilize the packaging technology of this wire-bonded typical silicon IGBT component. They deal with problems such as huge high-frequency parasitic specifications, not enough warmth dissipation ability, low-temperature resistance, and insufficient insulation strength, which limit using silicon carbide semiconductors. The display of exceptional efficiency. In order to address these problems and completely exploit the huge potential advantages of silicon carbide chips, several brand-new product packaging modern technologies and remedies for silicon carbide power modules have actually arised recently.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold cable bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have created from gold wires to copper wires, and the driving force is expense reduction; high-power gadgets have actually established from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product performance. The greater the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to connect chips and pins. Compared to traditional bonding packaging methods, Cu Clip innovation has the following advantages:
1. The connection in between the chip and the pins is made from copper sheets, which, to a particular level, replaces the common cable bonding approach in between the chip and the pins. For that reason, a special package resistance worth, higher existing flow, and far better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely conserve the price of silver plating and poor silver plating.
3. The item look is entirely constant with typical items and is mostly used in web servers, portable computers, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding method is much more pricey and complicated, but it can accomplish much better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cable bonding technique
The resource pad utilizes a Clip technique, and eviction uses a Wire technique. This bonding technique is slightly less expensive than the all-copper bonding technique, conserving wafer area (appropriate to very little gate areas). The process is easier than the all-copper bonding technique and can get much better Rdson and better thermal result.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding grounding wire with alligator clips, please feel free to contact us and send an inquiry.
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